Description
| Type | Fully automatic type for mass production (multilayer film formation) |
| Target wafer size | 4,5,6,8 inches |
| Use | Bump, Via, Rewiring, W-CSP, MEMS |
| Marking | SEMI-S2, SEMI-S8 and CE marking |
| Feature | ・ Continuous multi-type plating is possible in the same unit ・ Equipped with spin rinser dryer (dry in dry out) ・ Ring cathode that achieves high in-plane uniformity ・ Closed cup with high mist protection effect ・ Equipped with automatic cathode cleaner ・ Operation conditions can be registered and managed for each lot. ・ The number of plating cups can be increased in units of 2 cups. |
