Description
| Type | Experimental Equipment |
| Target wafer size | 4,5,6,8インチ |
| Use | Bump, Via, Rewiring, W-CSP, MEMS |
| Feature | ・ Equipped with Stir-Cup with paddle stirring mechanism in the cup -Small and lightweight design. Easy to move with casters ・ Can be operated with a plating solution of 10 L ・ Easy installation with 100V power supply and air ・ Equipped with a circulation filter ・ Improved maintainability with water supply / drainage pump ・ High aspect ratio with good beer filling ・ Good composition ratio uniformity of tin alloy plating |