TypeExperimental Equipment
Target wafer size4,5,6,8インチ
UseBump, Via, Rewiring, W-CSP, MEMS
Feature・ Equipped with Stir-Cup with paddle stirring mechanism in the cup
-Small and lightweight design. Easy to move with casters
・ Can be operated with a plating solution of 10 L
・ Easy installation with 100V power supply and air
・ Equipped with a circulation filter
・ Improved maintainability with water supply / drainage pump
・ High aspect ratio with good beer filling
・ Good composition ratio uniformity of tin alloy plating