We design and manufacture surface treatment equipment for connectors and lead frames, and various equipment for semiconductor wafers.

Service features

Achievements

In particular, we have a track record of introducing more than 100 units worldwide as a pioneer in plating equipment for semiconductor wafers.

Designed to meet your requirements.

“Easy to use”
“Easy to change to other product lines”
“Easy to maintain”
We produce customized equipment for our customers.

Abundant human resources

We have a large number of experienced engineers. We will respond quickly.

After-sales follow-up

We will provide continuous support.

Introduction of main production equipment

Posfer E Series

Posfer E Series

Cluster Type Plating Equipment

Cluster Type Plating Equipment

Leadframe Short Plating Equipment

Leadframe Short Plating Equipment

Leadframe Partial Plating Equipment

Leadframe Partial Plating Equipment

Highly integrated electronic circuits that play a central role
in the advancement of electronics technology

"Surface treatment technology"

that is indispensable for increasing the density of mounting technology

We provide a surface treatment process (surface treatment equipment) that plays a role in this.

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