Description
| Type | Electrolytic etching equipment (De-plating equipment) |
| Target wafer size | 4,5,6,8 inches |
| Use | Au etching Fully automatic etching of the seed layer |
| Feature | ・ Space-saving housing (2,400mm x 2,400mm) ・ Up to 6 cups installed ・ Equipped with spin rinser dryer (dry in dry out) ・ Recipes can be registered using the touch panel ・ Registration of operation conditions and operation management for each lot is possible |