De-Plating Equipment


TypeElectrolytic etching equipment (De-plating equipment)
Target wafer size4,5,6,8 inches
UseAu etching
Fully automatic etching of the seed layer
Feature・ Space-saving housing (2,400mm x 2,400mm)
・ Up to 6 cups installed
・ Equipped with spin rinser dryer (dry in dry out)
・ Recipes can be registered using the touch panel
・ Registration of operation conditions and operation management for each lot is possible