Manual Plating Equipment

Description

TypeManual plating equipment
Target wafer size2,3,4,5,6,8 inches
UseBump, Via, Rewiring, WLP, MEMS
Feature・ The cassette jig is made of resin to reduce weight.
・ The number of cups changes depending on the specifications (maximum 26 CUP)
・ Supports from 1cup experimental aircraft to mass-produced aircraft
・ By separating the control tank, it is possible to use several types of plating solution.
・ Recipes can be registered using the touch panel
・ Registration of operation conditions and operation management for each lot is possible