Description
Type | Manual plating equipment |
Target wafer size | 2,3,4,5,6,8 inches |
Use | Bump, Via, Rewiring, WLP, MEMS |
Feature | ・ The cassette jig is made of resin to reduce weight. ・ The number of cups changes depending on the specifications (maximum 26 CUP) ・ Supports from 1cup experimental aircraft to mass-produced aircraft ・ By separating the control tank, it is possible to use several types of plating solution. ・ Recipes can be registered using the touch panel ・ Registration of operation conditions and operation management for each lot is possible |