Description
Type | Plating equipment for square substrates Maximum 350 mm square substrate (compatible with ceramic, PCB, glass, etc. substrates) * Please contact us for 350 mm or more. |
Target wafer size | 4,5,6,8 inches |
Use | Bump, Via, Rewiring, WLP, MEMS |
Plating compatible | Compatible with composite plating (Cu, Ni, Au, etc.) |
Feature | ・ Can be mounted on jigs semi-automatically ・ Uses a cassette jig ・ Supports single-sided and double-sided plating by replacing the cassette jig ・ Improved film thickness uniformity by stirring the squeegee ・ Contact check is possible after mounting the wafer on the cassette jig (optional) ・ The cassette jig is made of resin and is lightweight. |