Plating Equipment for Square Substrates

Description

TypePlating equipment for square substrates
Maximum 350 mm square substrate (compatible with ceramic, PCB, glass, etc. substrates)
* Please contact us for 350 mm or more.
Target wafer size4,5,6,8 inches
UseBump, Via, Rewiring, WLP, MEMS
Plating compatibleCompatible with composite plating (Cu, Ni, Au, etc.)
Feature・ Can be mounted on jigs semi-automatically
・ Uses a cassette jig
・ Supports single-sided and double-sided plating by replacing the cassette jig
・ Improved film thickness uniformity by stirring the squeegee
・ Contact check is possible after mounting the wafer on the cassette jig (optional)
・ The cassette jig is made of resin and is lightweight.