Description
| Type | Rack type semi-automatic plating equipment |
| Target wafer size | 4,5,6,8 inches |
| Use | Bump, Via, rewiring, WLP, MEMS |
| Compatible with plating solution | Au, Cu, Ni, SnAg, etc. Supports composite plating such as Cu, Ni, SnAg |
| Feature | ・ Can be mounted on jigs semi-automatically ・ Uses a cassette jig ・ The cassette jig is made of resin to reduce weight. ・ Supports single-sided and double-sided plating by replacing the cassette jig ・ Improved film thickness uniformity by stirring the squeegee ・ Contact check is possible after mounting the wafer on the cassette jig (optional) |
