Racktype Semiauto Plating Equipment



TypeRack type semi-automatic plating equipment
Target wafer size4,5,6,8 inches
UseBump, Via, rewiring, WLP, MEMS
Compatible with plating solutionAu, Cu, Ni, SnAg, etc.
Supports composite plating such as Cu, Ni, SnAg
Feature・ Can be mounted on jigs semi-automatically
・ Uses a cassette jig
・ The cassette jig is made of resin to reduce weight.
・ Supports single-sided and double-sided plating by replacing the cassette jig
・ Improved film thickness uniformity by stirring the squeegee
・ Contact check is possible after mounting the wafer on the cassette jig (optional)