Description
| Type | Semi-automatic type for experimentation, development, and low volume production |
| Target wafer size | 4,5,6,8 inches |
| Use | Bump, Via, Rewiring, W-CSP, MEMS |
| Marking | SEMI-S2, SEMI-S8 and CE marking |
| Feature | ・ Equipped with Stir-Cup with paddle stirring mechanism in the cup ・ Closed cup with high mist protection effect ・ High aspect ratio with good beer filling ・ Good composition ratio uniformity of tin alloy plating ・ Process recipe transfer to fully automatic type (POSFER) is possible |
