Description
Type | Fully automatic cup type |
Target wafer size | 4,5,6,8 inches 4,5 inches up to 8 CUP, 6 inches up to 6 CUP, 8 inches up to 6 CUP |
Use | Bump, Via, Rewiring, WLP, MEMS |
Compatible with plating solution | Au, Cu, Ni, SnAg, etc. Supports composite plating such as Cu, Ni, SnAg |
Feature | ・ Space-saving housing (2,400mm x 2,400mm) ・ Equipped with spin rinser dryer (dry in dry out) ・ Levitro pump specifications: Compatible with non-cyan gold plating solution ・ Recipes can be registered using the touch panel ・ Registration of operation conditions and operation management for each lot is possible ・ Automatic cathode cleaner (optional) |