Description
| Type | Compact fully automatic type for mass production |
| Target wafer size | 4,5,6,8 inches |
| Use | Bump, via, rewiring, W-CSP, MEMS |
| Marking | SEMI-S2, SEMI-S8 and CE marking |
| Feature | ・ 40% reduction in footprint (compared to our company) One-frame structure ・ Equipped with Stir-Cup with paddle stirring mechanism in the cup ・ Improved maintainability with 2 cups / 1 tank ・ Equipped with spin rinser dryer (dry in dry out) ・ Ring cathode that achieves high in-plane uniformity ・ Closed cup with high mist protection effect ・ Equipped with automatic cathode cleaner ・ Operation conditions can be registered and managed for each lot. |
