TypeCompact fully automatic type for mass production
Target wafer size4,5,6,8 inches
UseBump, via, rewiring, W-CSP, MEMS
MarkingSEMI-S2, SEMI-S8 and CE marking
Feature・ 40% reduction in footprint (compared to our company) One-frame structure
・ Equipped with Stir-Cup with paddle stirring mechanism in the cup
・ Improved maintainability with 2 cups / 1 tank
・ Equipped with spin rinser dryer (dry in dry out)
・ Ring cathode that achieves high in-plane uniformity
・ Closed cup with high mist protection effect
・ Equipped with automatic cathode cleaner
・ Operation conditions can be registered and managed for each lot.